Why Choose the Mersen W208261 High-Speed Miniature Fuse?
The Mersen W208261, catalogue number MI5FAP25V3.15, is a high-speed semiconductor miniature fuse designed to provide exceptionally fast overcurrent protection for sensitive semiconductor devices, industrial electronics and power conversion equipment. Part of Mersen's 5 × 20 mm FA 250 V miniature fuse range with axial leads, it combines rapid fault interruption with convenient PCB and electronic assembly mounting.
With a rated current of 3.15 A and a rated operating voltage of 250 V AC, the W208261 is suitable for protecting instrumentation, power supplies, converters, inverters and automation equipment. Its very fast FA operating characteristic minimises fault energy, helping to safeguard valuable semiconductor components from damage.
The fuse features a robust 5 × 20 mm ceramic body with axial wire leads for direct solder mounting onto printed circuit boards and compact electronic assemblies. A 10 kA minimum interrupting rating together with low I²t values provides dependable protection in demanding electronic applications.
Key Advantages
- Designed for semiconductor and sensitive electronic circuit protection.
- 3.15 A rated current for industrial electronic applications.
- 250 V AC rated voltage.
- Ultra-fast FA operating characteristic.
- Axial leads simplify PCB mounting and electronic assembly.
- Compact 5 × 20 mm ceramic cartridge.
- 10 kA minimum interrupting rating.
- Low I²t values help minimise damage to semiconductor devices.
- UL recognised and RoHS compliant.
Key Features
- Mersen 5 × 20 mm FA 250 V axial lead semiconductor fuse series.
- Catalogue number: MI5FAP25V3.15.
- 3.15 A rated current.
- 250 V AC rated voltage.
- High-speed FA operating characteristic.
- Ceramic fuse body with axial wire leads.
- Direct PCB solder mounting.
- Pre-arcing I²t: 2.46 A²s.
- Clearing I²t: 5.5 A²s.
- Designed for semiconductor protection applications.
Reliable Protection for Semiconductor Equipment
The Mersen W208261 is specifically engineered to protect semiconductor devices where rapid fault clearance is essential. Its very fast FA characteristic and low I²t performance help minimise the energy released during fault conditions, reducing the risk of damage to sensitive electronic components.
The axial lead construction allows direct integration into printed circuit boards and electronic assemblies, while the ceramic body provides excellent thermal stability and electrical insulation for dependable long-term performance.
Typical Applications
- Semiconductor protection.
- Industrial electronic equipment.
- Power supplies.
- Automation and control systems.
- Instrumentation equipment.
- Printed circuit board assemblies.
- Power conversion equipment.
- OEM electronic machinery.
