Why Choose the Mersen H208249 High-Speed Miniature Fuse?
The Mersen H208249, also identified by the catalogue number MI5FAP25V0.16, is a compact high-speed semiconductor miniature fuse designed to protect sensitive electronic components against damaging overcurrents and short circuits. It forms part of Mersen’s FA range of 5 × 20 mm miniature fuse-links with axial leads for direct integration into electronic assemblies.
Its very fast-acting characteristic helps limit the electrical energy transmitted during a fault, reducing thermal and electrical stress on semiconductor devices and associated circuitry. This rapid response makes the H208249 suitable for applications where conventional general-purpose fuses may not operate quickly enough to protect delicate electronic components.
With a rated current of 0.16 A, a rated voltage of 250 V AC and axial leads for soldered installation, the fuse is suitable for low-current electronic and industrial control circuits. Its ceramic body, high-speed FA design and 10 kA minimum interrupting rating provide dependable protection in compact equipment.
Key Advantages
- High-speed FA characteristic for semiconductor protection.
- 0.16 A rated current for sensitive low-current circuits.
- 250 V AC voltage rating for compatible electronic equipment.
- Compact 5 × 20 mm miniature fuse format.
- Axial leads allow direct soldering onto printed circuit boards.
- 10 kA minimum interrupting rating for reliable fault clearance.
Key Features
- Mersen FA semiconductor miniature fuse series.
- Catalogue number: MI5FAP25V0.16.
- 0.16 A ampere rating.
- 250 V AC rated voltage.
- High-speed, very fast-acting operating characteristic.
- Ceramic cylindrical cartridge body.
- Axial leads with soldered connections.
- RoHS-compliant construction.
Fast Protection for Sensitive Electronic Components
Semiconductor devices and low-current electronic circuits can be damaged rapidly when exposed to excessive current. The Mersen H208249 uses a high-speed FA fuse element to disconnect the circuit quickly, helping to limit fault energy and reduce the risk of damage to protected components.
Its axial lead configuration allows the fuse to be soldered directly onto a printed circuit board or connected within a compact electronic assembly. This provides a secure electrical connection and supports efficient integration without requiring a separate panel-mounted fuse holder.
Typical Applications
- Semiconductor device protection.
- Printed circuit boards and electronic assemblies.
- Industrial control and automation equipment.
- Power supplies and control modules.
- Instrumentation and measurement systems.
- Electronic switching and signal circuits.
